Malaysia Semiconductor IC Design Park on track to meet 400-engineer target by end-2026 — Sidec

KUALA LUMPUR (April 28): The Malaysia Semiconductor IC Design Park has hired 302 engineers to date, putting it on track to meet its 400-engineer target by end-2026, said the Selangor Information Technology & Digital Economy Corporation (Sidec).

About 80% of those hired are fresh graduates, reflecting the ecosystem’s strong role in creating early-career opportunities while building local semiconductor talent, said Sidec in a statement on Monday.

“Based on current progress, the hiring trajectory is on course to surpass the initial KPI set for the year,” it said.

The park is spearheaded by Sidec with the support of the Ministry of Economy and the Selangor government, to accelerate the growth of Malaysia’s semiconductor front-end ecosystem, particularly in integrated circuit (IC) design. It currently hosts 15 active companies.

Sidec said all companies are actively hiring and expanding, with demand remaining particularly strong for technical roles such as IC design engineers specialising in custom layout and verification, and firmware engineers.

Apart from hiring 400 engineers by end-2026, Sidec said the park is also targeting to support the emergence of its first initial public offering company.

Sidec noted that the park’s growing ecosystem is supporting high-impact sectors such as data centres, automotive and aerospace.

Talent development remains a central pillar of the ecosystem’s growth, with the Advanced Semiconductor Academy of Malaysia having trained 360 students to date to support industry growth, it added.

Malaysia launched its first IC design park in Puchong in August 2024, followed by a second facility in Cyberjaya in November 2025.

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